cystech electronics corp. spec. no. : c291sh issued date : 2009.12.22 revised date : page no. : 1/5 CSOD0540SH cystek product specification 0.5a surface mount schottky diode CSOD0540SH features ? high current capability, low forward voltage drop ? high surge current capability ? guardring for over voltage protection ? low power loss, high efficiency ? ultra high-speed switching ? low profile surface mounted package in order to minimize board space ? pb-free package mechanical data ?case : molded plastic, jedec sod-123. ? epoxy : ul94-v0 rated flame retardant ? terminals : plated terminals, so lderable per mil-std-202 method 208 ?polarity : indicated by cathode band ? mounting position : any ? weight : approx. 0.04 gram symbol outline CSOD0540SH 2 (anode) sod-123
cystech electronics corp. spec. no. : c291sh issued date : 2009.12.22 revised date : page no. : 2/5 CSOD0540SH cystek product specification absolute maximum ratings (t a =25 , unless otherwise noted) parameters conditions symbol min typ max units repetitive peak reverse voltage v rrm 40 v rms voltage v rms 28 v continuous reverse voltage v r 40 v i o 0.5 forward rectified current single phase half wave, 60hz @t j =25 c i f(av) 1 a forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm 15 a thermal resistance junction to ambient r ja 250 c/w storage temperature range tstg -65 175 c operating junction temperature range tj -55 125 c characteristics (t a =25 c) characteristic symbol condition min. typ max. unit v r i r =600 a 40 - - v v f 1 i f =100ma - - 370 forward voltage v f 2 i f =500ma - - 500 mv i r 1 v r =20v - - 100 a i r 2 v r =40v - - 500 a reverse leakage current i r 3 v r =40v, t a =75 c - - 10 ma junction capacitance c j v r =4v, f=1mhz - 18.3 - pf ordering information device package shipping CSOD0540SH sod-123 (pb-free package) 3000 pcs / tape & reel
cystech electronics corp. spec. no. : c291sh issued date : 2009.12.22 revised date : page no. : 3/5 CSOD0540SH cystek product specification characteristic curves forward current derating curve 0 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125 150 175 ambient temperature---t a () average forward current---io(a) resistive or inductive load maximum non-repetitive forward surge current 0 3 6 9 12 15 1 10 100 number of cycles at 60hz peak forward surge current---i fsm (a) tj=25, 8.3ms single half sine wave, jedec method forward current vs forward voltage 1 10 100 1000 0 0.2 0.4 0.6 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=75 tj=125 junction capacitance vs reverse voltage 10 100 0.1 1 10 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz reverse leakage current vs reverse voltage 10 100 1000 10000 0 20 40 60 80 100 120 140 percent of rated peak reverse voltage---(%) reverse leakage current---i r (a) tj=75 t j =25
cystech electronics corp. spec. no. : c291sh issued date : 2009.12.22 revised date : page no. : 4/5 CSOD0540SH cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c291sh issued date : 2009.12.22 revised date : page no. : 5/5 CSOD0540SH cystek product specification sod-123 dimension inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.102 0.110 2.600 2.800 d 0.018 0.026 0.450 0.650 b 0.059 0.067 1.500 1.700 e 0.140 0.152 3.550 3.850 c 0.041 0.049 1.050 1.250 notes: 1.controlling dimension : millimeters. 2.lead thickness specified per l/f drawing with solder plating. 3.if there is any question with pa cking specification or packing me thod, please contact your local cystek sales office. material: ? lead: pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . marking: 04 2-lead sod-123 plastic surface mounted package cystek package code: sh style: pin 1.cathode 2.anode
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